Dry Film Photo-Resist (DFR)´Â Àμâȸ·Î±âÆÇ (PCB: Printed Circuit Board), Lead Frame, PDP, BGA, ´Ù¸¥ ±Ý¼Ó µî¿¡ ȸ·Î³ª ÆÐÅÏ Çü¼ºÀ» À§ÇØ »ç¿ëµÇ¾îÁö´Â Á¦Ç°ÀÔ´Ï´Ù.
¿À´Ã³¯ ÀüÀÚ»ê¾÷ÀÇ °æÇâÀº °í¹Ðµµ¿Í ¼ÒÇüÈ­¿¡ ÁßÁ¡À» µÎ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ °æÇâ¿¡ ¹ß¸ÂÃß¾î DFRµµ ´õ ³ôÀº ÇØ»óµµ, ¶Ù¾î³­ ¹ÐÂø¼º, Ź¿ùÇÑ ÃßÁ¾¼ºÀ» Á¦°øÇϰí ÀÖ½À´Ï´Ù.
R&D¿¡ ÁßÁ¡À» µÎ°í ÀÖ´Â ¢ßÄÚ¿À·ÕÀº °í°´ÀÇ ´Ù¾çÇÑ ¿ä±¸¸¦ ¸¸Á·½Ãų ¼ö ÀÖ´Â ¿ì¼öÇÑ Á¦Ç°À» Á¦°øÇϰí ÀÖÀ¸¸ç PCB»ê¾÷ÀÇ º¯È­¿¡ È¿°úÀûÀ¸·Î ´ëÀÀÇϰí ÀÖ½À´Ï´Ù.
Accuimage¢ç´Â ¢ßÄÚ¿À·ÕÀÇ Dry Film Photo-Resist Á¦Ç°ÀÌ¸ç ´ÙÃþÀÇ Á¤±³ÇÑ ±âÆÇ À§¿¡ ÃʼÒÇü ȸ·Î¸¦ Çü¼ºÇÒ ¼ö ÀÖ´Â ¼ö¿ë¼º Negative TypeÀÇ Dry Film Photo-Resist ÀÔ´Ï´Ù.

    ¡Ü ¿ì¼öÇÑ ÄÚÆÃ ±ÕÀϵµ ¹× ÆÐÅÏ ±ÕÀϵµ
    ¡Ü Çö»ó°øÁ¤¿¡¼­ÀÇ ¿ì¼öÇÑ ÆÐÅÏ ¾ÈÁ¤¼º
    ¡Ü ¿ì¼öÇÑ ¾ÐÃà ȸº¹ ¹°¼º
    ¡Ü ¿ì¼öÇÑ °¨µµ ¹× ÇØ»óµµ

Accuimage¢ç Line-up
Application Grade Tickness
Tenting&Etching KS-8700, FF-1000, DK-8900 30 40 50
Plating KP-2200, KP-2600 40 50
FPCB TK-8800 15 20 25
Gold Plating KM-1100 40 50
ENIG&Alkaline Etching KX-1300 30 40 50
Lead Frame KG-5200, KH-3100, UH-3200, UH-3400 15 20 25
Package Substrates UK-9000, US-9100 10 15 20 25 30
LDI KB-1500 30 40
PDP KD-5100 30
Thick Film NM-5000 100 120 150
Posi Type DFR Rubyguard 3 5 7


Optical Film
Diffuser sheet
Diffuser plate
Prism sheet
Chemicals
OverCoat
Column Spacer
Black Matrix
Passivation
Beads
PCB Materials
Dry Film Photo-Resist
Liquid Photo-Resist Ink