Photomaster¢ç : Negative Type Photo-Resist Ink
Photomaster¢ç´Â ¢ßÄÚ¿À·ÕÀÇ PCB ³»Ãþ¿ë, PDP Etching¿ë µî¿¡ »ç¿ëµÇ´Â Negative TypeÀÇ ¾×»ó Photo-Resist Á¦Ç°ÀÔ´Ï´Ù.

    ¡Ü °íÇØ»óµµ(1mil) ¹× ³ôÀº ¼öÀ²ÀÇ »ý»ê¼º(> 99%)
    ¡Ü ¾ËÄ®¸® ¿¡Äª¾×¿¡ ´ëÇÑ ¶Ù¾î³­ ³»¼º
    ¡Ü ¿ì¼öÇÑ ÄÚÆÃ¼º
    ¡Ü ¿ì¼öÇÑ Ç¥¸é°æµµ

  ¢º Photomaster¢ç Line-Up
    ¡Ü Photomaster¢ç ND-066, ND-088
    - Liquid Photoimageable Etching Resist Ink for Dip Coating
    Application
    ¡Ü Photomaster¢ç NR-027
    - Liquid Photoimageable Etching Resist Ink for Roller Coating
    Application

Rubyguard¢ç : Positive Type Photo-Resist Ink
Rubyguard¢ç´Â ¢ßÄÚ¿À·ÕÀÇ COF, LCD °øÁ¤¿¡ »ç¿ëµÇ´Â Positive TypeÀÇ ¾×»ó Photo-Resist Á¦Ç°ÀÔ´Ï´Ù.

    ¡Ü ÃʰíÇØ»ó Pattern ±¸Çö
    ¡Ü Ź¿ùÇÑ Chemical Resistance
    ¡Ü ¿ì¼öÇÑ ÄÚÆÃ¼º

Rubygaurd¢ç Process Properties
Substrate Copper
PR Properties Customized Property
(Standard : Viscosity-20cp, Solid Content : 20.0wt%)
PR Thickness after Drying 2.2 ¡¾ 0.2§­
Drying 110~120¡É / 50~60sec, Convection Oven
Exposure
(after cooling Room Temp.)
60~80mJ/§²
Developing 0.9~1.0 wt% KOH(Dipping Method),
Developing time 40~60sec, 25¡É
Optical Film
Diffuser sheet
Diffuser plate
Prism sheet
Chemicals
OverCoat
Column Spacer
Black Matrix
Passivation
Beads
PCB Materials
Dry Film Photo-Resist
Liquid Photo-Resist Ink