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Photomaster¢ç : Negative Type Photo-Resist Ink |
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Photomaster¢ç´Â ¢ßÄÚ¿À·ÕÀÇ PCB ³»Ãþ¿ë, PDP Etching¿ë µî¿¡ »ç¿ëµÇ´Â Negative TypeÀÇ ¾×»ó Photo-Resist Á¦Ç°ÀÔ´Ï´Ù.
¡Ü °íÇØ»óµµ(1mil) ¹× ³ôÀº ¼öÀ²ÀÇ »ý»ê¼º(> 99%)
¡Ü ¾ËÄ®¸® ¿¡Äª¾×¿¡ ´ëÇÑ ¶Ù¾î³ ³»¼º
¡Ü ¿ì¼öÇÑ ÄÚÆÃ¼º
¡Ü ¿ì¼öÇÑ Ç¥¸é°æµµ
¢º Photomaster¢ç Line-Up
¡Ü Photomaster¢ç ND-066, ND-088
- Liquid Photoimageable Etching Resist Ink for Dip Coating Application
¡Ü Photomaster¢ç NR-027
- Liquid Photoimageable Etching Resist Ink for Roller Coating Application
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| Rubyguard¢ç : Positive Type Photo-Resist Ink |
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Rubyguard¢ç´Â ¢ßÄÚ¿À·ÕÀÇ COF, LCD °øÁ¤¿¡ »ç¿ëµÇ´Â Positive TypeÀÇ ¾×»ó Photo-Resist Á¦Ç°ÀÔ´Ï´Ù.
¡Ü ÃʰíÇØ»ó Pattern ±¸Çö
¡Ü Ź¿ùÇÑ Chemical Resistance
¡Ü ¿ì¼öÇÑ ÄÚÆÃ¼º
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Rubygaurd¢ç Process Properties
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Substrate
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Copper
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PR Properties |
Customized Property (Standard : Viscosity-20cp, Solid Content : 20.0wt%) |
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PR Thickness after Drying |
2.2 ¡¾ 0.2§ |
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Drying |
110~120¡É / 50~60sec, Convection Oven |
Exposure (after cooling Room Temp.) |
60~80mJ/§² |
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Developing |
0.9~1.0 wt% KOH(Dipping Method), Developing time 40~60sec, 25¡É |
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